东华大学学报（自然科学版）

民用航空领域的芳纶蜂窝复合结构通常采用高性能灌封胶提升整体机械强度，但填充灌封胶后大厚度蜂窝在固化过程中易发生暴聚。以环氧树脂为基体，采用酸酐类固化剂并引入2-乙基-4-甲基咪唑(2E4MI)固化促进剂，通过复配触变剂和玻璃微珠等辅助填料，制备单组分环氧树脂胶黏剂；对其力学性能、热性能和工艺稳定性进行测试与表征。2E4MI质量分数为0.16%时，胶黏剂的玻璃化转变温度(t_g)达237.44℃,较无促进剂体系提高31.14℃。在121℃/1.5 h固化制度下，胶黏剂的常温(25℃)压缩强度和177℃压缩强度分别达143.52和82.52 MPa,在177℃/1 h固化制度下，胶黏剂的常温压缩强度和177℃压缩强度分别达148.63和85.19 MPa,展现出优异的耐热性和力学性能。此外，胶黏剂在-18℃环境下具备3个月的储存寿命，室温下施工时间可达18 h。实际蜂窝填充及高温固化试验表明蜂窝无暴聚和膨胀现象，验证了胶黏剂在大厚度蜂窝结构中固化的稳定性和可靠性，对国产民用航空领域的蜂窝灌封具有参考和应用价值。

Aramid honeycomb composite structures in civil aviation applications typically require high-performance potting compounds to enhance mechanical integrity. However, conventional thick-layer honeycomb curing processes often suffer from violent polymerization. This study presents a single-component epoxy adhesive system comprising an epoxy resin matrix, anhydride curing agents, and 2-ethyl-4-methylimidazole(2E4MI) as a curing accelerator, supplemented with thixotropic agents and glass microspheres. The mechanical properties, thermal behavior, and process stability of the formulated adhesive were systematically investigated. When the mass fraction of 2E4MI was 0.16%, the glass transition temperature(t_g) of the adhesive increased significantly to 237.44 ℃, representing a 31.14 ℃ improvement over the accelerator-free system. Under 121 ℃/1.5 h curing regimen, the adhesive demonstrated compressive strengths of 143.52 MPa at room temperature and 82.52 MPa at elevated temperature. Remarkably, these mechanical properties remained consistent(148.63 MPa and 85.19 MPa) even when cured under more stringent 177 ℃/1 h conditions, confirming exceptional thermal stability. The formulated adhesive exhibited a 3-month shelf life at-18 ℃ and maintained 18 h of workable time at ambient temperature. Practical application tests in honeycomb filling and high-temperature curing demonstrated the absence of violent polymerization or expansion phenomena, validating the system's reliability for thick-section honeycomb structures. This development provides valuable insights for domestic civil aviation applications requiring dimensionally stable potting solutions, addressing critical challenges in honeycomb composite manufacturing.